LTCC is a type of multilayer ceramic substrate that made by lower temperature (usually from 850 to 900?) firing process than general ceramic firing process by adding gl** to alumina. It makes it possible to use low resistive conductor as conductor patterns in. In this report, we research and **yze the devices which made by the LTCC technology, mainly include three categories of devices, LTCC components, LTCC substrates and LTCC modules. The LTCC components include LC filters, directional coupler, power splitter and antenna etc. The LTCC substrates include Bluetooth substrates and mobile front-end module substrates etc. And the LTCC modules include phone antenna modules, Bluetooth modules and power amplifier modules etc.  The global Low Temperature Co-fired Ceramic (LTCC) market size is estimated at *** million USD with a CAGR xx% from 2015-2019 and is expected to reach *** Million USD in 2020 with a CAGR xx% from 2020 to 2025. The report begins from overview of Industry Chain structure, and describes industry environment, then **yses market size and forecast of Low Temperature Co-fired Ceramic (LTCC) by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price **ysis and value chain features are covered in this report. Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.): LTCC Components LTCC Substrates LTCC Module Company Coverage (Company Profile, Sales Revenue, Price, Gross Margin, Main Products etc.): Murata(JP) Kyocera(JP) TDK(JP) Taiyo Yuden(JP) KOA Corporation(JP) Yokowo(JP) Hitachi Metals(JP) NIKKO(JP) Soshin Electric(JP) Bosch(DE) IMST GmbH(DE) MST(DE) Via Electronic(DE) Adamant(JP) API Technologies(BE) Selmic(FL) VTT(FL) American Technical Ceramics(US) NEO Tech(US) NTK Technologies(US) Northrop Grumman(US) Samsung Electro-Mechanics(KR) PILKOR CND(KR) ACX Corp(TW) Yageo(TW) Walsin Technology(TW) Darfon Materials(TW) Elit Fine Ceramics(TW) Sunlord(CN) CETC 43rd Institute(CN) CNIGC 214th Institute(CN) ChengDian Electronic(CN) Microgate(CN) Fenghua Advanced Technology(CN) Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.): Consumer Electronics Aerospace & Military Automobile Electronics Region Coverage (Regional Production, Demand & Forecast by Countries etc.): North America (U.S., Canada, Mexico) Europe (Germany, U.K., France, Italy, Russia, Spain etc.) Asia-Pacific (China, India, Japan, Southeast Asia etc.) South America (Brazil, Argentina etc.) Middle East & Africa (Saudi Arabia, South Africa etc.)
By: Neha Roy
2020-04-08
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